The present invention provides a resin composition comprising: (A) a thermoplastic resin, (B) a granular material which has a number average particle diameter of 0.5 to 5 mm and is obtainable by granulating a fiber mainly having alumina with a number average fiber diameter of 1 to 50 μm, and (C) a filler composed of a material of which electric resistivity at 300 K is 102 Ωm or less. The resin composition can be molded into a molded article with electric insulation. The electric resistivity of the molded article has sufficient electric insulation in applications such as in electric and electronic parts.