Invention Grant
- Patent Title: Thermosetting resin compositions and articles
- Patent Title (中): 热固性树脂组合物和制品
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Application No.: US12870477Application Date: 2010-08-27
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Publication No.: US08258216B2Publication Date: 2012-09-04
- Inventor: Wei Qiang , Ke Wang , Doug Leys , Greg Almen
- Applicant: Wei Qiang , Ke Wang , Doug Leys , Greg Almen
- Applicant Address: US NY Melville
- Assignee: Park Electrochemical Corporation
- Current Assignee: Park Electrochemical Corporation
- Current Assignee Address: US NY Melville
- Agency: Fish & Richardson P.C.
- Main IPC: C08K5/52
- IPC: C08K5/52 ; H05K1/00 ; B05D5/12
Abstract:
The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz.
Public/Granted literature
- US20110048776A1 THERMOSETTING RESIN COMPOSITIONS AND ARTICLES Public/Granted day:2011-03-03
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