Invention Grant
- Patent Title: Laminating resin composition and multilayer structure
- Patent Title (中): 层压树脂组合物和多层结构
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Application No.: US12745245Application Date: 2008-11-25
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Publication No.: US08258227B2Publication Date: 2012-09-04
- Inventor: Kuniaki Kawabe , Hirotaka Uosaki , Motoyasu Yasui , Hideo Nakamura , Yasushi Amada , Akihito Ohga
- Applicant: Kuniaki Kawabe , Hirotaka Uosaki , Motoyasu Yasui , Hideo Nakamura , Yasushi Amada , Akihito Ohga
- Applicant Address: JP Tokyo
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2007-307188 20071128
- International Application: PCT/JP2008/071349 WO 20081125
- International Announcement: WO2009/069595 WO 20090604
- Main IPC: C08K5/01
- IPC: C08K5/01 ; C08F210/00

Abstract:
Laminating resin compositions of the invention enable excellent productivity in the lamination processes, and are free from deterioration in optical characteristics such as transparency or surface properties inherent to resins such as polypropylenes. Multilayer structures obtained by laminating the composition on a substrate have tear strength which is as high as that of multilayer structures obtained by simply laminating a polyolefin resin such as polypropylene on a substrate. The laminating resin composition includes a polyolefin resin and a polyethylene wax having a density in the range of 890 to 955 kg/m3 as measured by a density gradient tube method in accordance with JIS K 7112 and a number average molecular weight (Mn) in terms of polyethylene in the range of 500 to 2900 as measured by gel permeation chromatography (GPC).
Public/Granted literature
- US20100286326A1 LAMINATING RESIN COMPOSITION AND MULTILAYER STRUCTURE Public/Granted day:2010-11-11
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