Invention Grant
- Patent Title: Laser beam processing machine
- Patent Title (中): 激光束加工机
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Application No.: US11822657Application Date: 2007-07-09
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Publication No.: US08258428B2Publication Date: 2012-09-04
- Inventor: Hiroshi Morikazu
- Applicant: Hiroshi Morikazu
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2006-190539 20060711
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/067

Abstract:
A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction and an indexing-feed means for moving the chuck table and the laser beam application means in an indexing-feed direction perpendicular to the processing-feed direction, wherein the laser beam application means comprises a first laser beam application means for applying a first pulse laser beam having an energy density per one pulse of 20 to 60 J/cm2 and a second laser beam application means for applying a second pulse laser beam having an energy density per one pulse of 3 to 20 J/cm2.
Public/Granted literature
- US20080011723A1 Laser beam processing machine Public/Granted day:2008-01-17
Information query
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