Invention Grant
- Patent Title: Light-emitting element and method of making the same
- Patent Title (中): 发光元件及其制造方法
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Application No.: US12616929Application Date: 2009-11-12
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Publication No.: US08258529B2Publication Date: 2012-09-04
- Inventor: Taichiroo Konno , Nobuaki Kitano
- Applicant: Taichiroo Konno , Nobuaki Kitano
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2009-152344 20090626
- Main IPC: H01L33/10
- IPC: H01L33/10 ; H01L33/22

Abstract:
A light-emitting element includes a semiconductor substrate, a light emitting portion including an active layer sandwiched between a first cladding layer of a first conductivity type and a second cladding layer of a second conductivity type different from the first conductivity type, a reflective portion provided between the semiconductor substrate and the light emitting portion for reflecting light emitted from the active layer, and a current spreading layer provided on the light emitting portion opposite to the reflective portion and including a concavo-convex portion on a surface thereof. The reflective portion includes a plurality of pair layers each including a first semiconductor layer and a second semiconductor layer different from the first semiconductor layer, and the first semiconductor layer has a thickness TA1 defined by formulas (1) and (3), and the second semiconductor layer has a thickness TB1 defined by formulas (2) and (4).
Public/Granted literature
- US20100327298A1 LIGHT-EMITTING ELEMENT AND METHOD OF MAKING THE SAME Public/Granted day:2010-12-30
Information query
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