A light emitting device package is provided. The light emitting device package may include a package body having a cavity formed therein, a lead frame, and a light emitting device positioned in the cavity and electrically connected to the lead frame. The lead frame may penetrate the package body such that one end of the lead frame is positioned in the cavity and the other end of the lead frame is exposed to an outside of the package body. The lead frame may be partially coated with a thin metal layer.