Invention Grant
- Patent Title: High-k metal gate device
- Patent Title (中): 高k金属门装置
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Application No.: US13186656Application Date: 2011-07-20
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Publication No.: US08258546B2Publication Date: 2012-09-04
- Inventor: Cheng-Lung Hung , Yong-Tian Hou , Keh-Chiang Ku , Chien-Hao Huang
- Applicant: Cheng-Lung Hung , Yong-Tian Hou , Keh-Chiang Ku , Chien-Hao Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/118
- IPC: H01L27/118

Abstract:
A semiconductor device includes a semiconductor substrate and a transistor formed in the substrate, the transistor having a gate stack that has an interfacial layer formed on the substrate, a high-k dielectric layer formed over the interfacial layer, a metal layer formed over the high-dielectric layer, a capping layer formed between the interfacial layer and high-k dielectric layer; and a doped layer formed on the metal layer, the doped layer including at least F.
Public/Granted literature
- US20110272766A1 High-K Metal Gate Device Public/Granted day:2011-11-10
Information query
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