Invention Grant
- Patent Title: Semiconductor device having extra capacitor structure
- Patent Title (中): 具有额外的电容器结构的半导体器件
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Application No.: US13008908Application Date: 2011-01-19
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Publication No.: US08258555B2Publication Date: 2012-09-04
- Inventor: Wei-Chieh Lin
- Applicant: Wei-Chieh Lin
- Applicant Address: TW Hsinchu Science Park, Hsinchu
- Assignee: Sinopower Semiconductor Inc.
- Current Assignee: Sinopower Semiconductor Inc.
- Current Assignee Address: TW Hsinchu Science Park, Hsinchu
- Agent Winston Hsu; Scott Margo
- Priority: TW99129067A 20100820
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor device includes a semiconductor substrate having a conductive type, a source metal layer, a gate metal layer, at least one transistor device, a heavily doped region having the conductive type, a capacitor dielectric layer, a conductive layer. The source metal layer and the gate metal layer are disposed on the semiconductor substrate. The transistor device is disposed in the semiconductor substrate under the source metal layer. The heavily doped region, the capacitor dielectric layer and the conductive layer constitute a capacitor structure, disposed under the gate metal layer, and the capacitor structure is electrically connected between a source and a drain of the transistor device.
Public/Granted literature
- US20120049263A1 SEMICONDUCTOR DEVICE HAVING EXTRA CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-03-01
Information query
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