Invention Grant
- Patent Title: Encapsulant interposer system with integrated passive devices and manufacturing method therefor
- Patent Title (中): 具有集成无源器件的封装插件系统及其制造方法
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Application No.: US12942084Application Date: 2010-11-09
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Publication No.: US08258612B2Publication Date: 2012-09-04
- Inventor: Heap Hoe Kuan , Rui Huang , Yaojian Lin , Seng Guan Chow
- Applicant: Heap Hoe Kuan , Rui Huang , Yaojian Lin , Seng Guan Chow
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A method of manufacturing a semiconductor package system includes: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer.
Public/Granted literature
- US20110049687A1 ENCAPSULANT INTERPOSER SYSTEM WITH INTEGRATED PASSIVE DEVICES AND MANUFACTURING METHOD THEREFOR Public/Granted day:2011-03-03
Information query
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