Invention Grant
- Patent Title: Integrated circuit package system with package integration
- Patent Title (中): 集成电路封装系统，封装集成
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Application No.: US11938371Application Date: 2007-11-12
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Publication No.: US08258614B2Publication Date: 2012-09-04
- Inventor: Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Abelardo Jr. Hadap Advincula , Lionel Chien Hui Tay
- Applicant: Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Abelardo Jr. Hadap Advincula , Lionel Chien Hui Tay
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H01L23/06
- IPC: H01L23/06
Abstract:
An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from forming in the cavity.
Public/Granted literature
- US20090121335A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION Public/Granted day:2009-05-14
Information query
IPC分类:
