Invention Grant
US08258622B2 Power device package and semiconductor package mold for fabricating the same
有权
功率器件封装和用于制造其的半导体封装模具
- Patent Title: Power device package and semiconductor package mold for fabricating the same
- Patent Title (中): 功率器件封装和用于制造其的半导体封装模具
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Application No.: US12011844Application Date: 2008-01-29
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Publication No.: US08258622B2Publication Date: 2012-09-04
- Inventor: Keun-hyuk Lee , Seung-won Lim , Sung-min Park
- Applicant: Keun-hyuk Lee , Seung-won Lim , Sung-min Park
- Applicant Address: KR Dodang-Dong, Wonmi-Gu Bucheon-Si, Gyeonggi-Do
- Assignee: Fairchild Korea Semiconductor, Ltd.
- Current Assignee: Fairchild Korea Semiconductor, Ltd.
- Current Assignee Address: KR Dodang-Dong, Wonmi-Gu Bucheon-Si, Gyeonggi-Do
- Agency: Kirton McConkie, PC
- Agent Kenneth E. Horton
- Priority: KR10-2007-0020564 20070228
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34
Abstract:
Provided are a power device package coupled to a heat sink using a bolt and a semiconductor package mold for fabricating the same. The power device package includes: a substrate; at least one power device mounted on the substrate; a mold member sealing the substrate and the power device; and at least one bushing member fixed to the mold member to provide a through hole for a bolt member for coupling a heat sink to the mold member.
Public/Granted literature
- US20080203559A1 Power device package and semiconductor package mold for fabricating the same Public/Granted day:2008-08-28
Information query
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