Invention Grant
- Patent Title: Contact pad array
- Patent Title (中): 接触垫阵列
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Application No.: US13071490Application Date: 2011-03-24
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Publication No.: US08258634B2Publication Date: 2012-09-04
- Inventor: Chung-Lung Li , Yun-Chung Lin
- Applicant: Chung-Lung Li , Yun-Chung Lin
- Applicant Address: TW
- Assignee: AU Optronics Corp. Science-Based Industrial Park, Hsin-Chu
- Current Assignee: AU Optronics Corp. Science-Based Industrial Park, Hsin-Chu
- Current Assignee Address: TW
- Agent Winston Hsu; Scott Margo
- Priority: TW99137512A 20101101
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A contact pad array is provided. The contact pad array includes a plurality of first contact pads and a plurality of second contact pads. The first contact pads are arranged along the first direction. Each first contact pad includes two first lengthwise sides and two widthwise sides. The second contact pads are arranged along the first direction. Each second contact pad includes two second lengthwise sides and two second widthwise sides. The length of the second lengthwise side is substantially shorter than that of the first lengthwise side, and the width of the second widthwise side is substantially larger than that of the first widthwise side. The projection of the first widthwise side of each first contact pad on the first direction is completely within the projection of the second widthwise side of the corresponding second contact pad on the first direction.
Public/Granted literature
- US20120104620A1 CONTACT PAD ARRAY Public/Granted day:2012-05-03
Information query
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