Invention Grant
US08258888B2 Substrate device with a transmission line connected to a connector pad and method of manufacture
有权
具有连接到连接器焊盘的传输线的基板装置和制造方法
- Patent Title: Substrate device with a transmission line connected to a connector pad and method of manufacture
- Patent Title (中): 具有连接到连接器焊盘的传输线的基板装置和制造方法
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Application No.: US12588731Application Date: 2009-10-26
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Publication No.: US08258888B2Publication Date: 2012-09-04
- Inventor: Hidetaka Ootsuka
- Applicant: Hidetaka Ootsuka
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2008-275509 20081027
- Main IPC: H01P5/02
- IPC: H01P5/02
Abstract:
A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other.
Public/Granted literature
- US20100103636A1 Substrate device and its manufacturing method Public/Granted day:2010-04-29
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