Invention Grant
US08259223B2 Imaging module 有权
成像模块

  • Patent Title: Imaging module
  • Patent Title (中): 成像模块
  • Application No.: US12934260
    Application Date: 2009-03-03
  • Publication No.: US08259223B2
    Publication Date: 2012-09-04
  • Inventor: Hiroshi Okada
  • Applicant: Hiroshi Okada
  • Applicant Address: JP Kyoto
  • Assignee: Kyocera Corporation
  • Current Assignee: Kyocera Corporation
  • Current Assignee Address: JP Kyoto
  • Agency: DLA Piper LLP (US)
  • Priority: JP2008-080818 20080326
  • International Application: PCT/JP2009/053971 WO 20090303
  • International Announcement: WO2009/119260 WO 20091001
  • Main IPC: H04N5/225
  • IPC: H04N5/225
Imaging module
Abstract:
An imaging module includes an imaging substrate mounting an imaging device thereon, a substrate holding plate, a holder. The substrate holding plate includes four substrate securing portions for securing the imaging substrate that are located opposing to four corners of the imaging substrate, respectively, an opening portion surrounded by the four substrate securing portions, and four holder securing portions that are located outwardly from the four substrate securing portions in a longitudinal direction thereof, respectively. The holder is formed integrally with a lens support barrel configured to support a lens unit at an inside thereof, and has plate securing portions configured to secure the holder securing portions at positions opposed to the holder securing portions of the substrate holding plate, respectively. The imaging module causes little residual compressive stress left in the imaging substrate, so that it can acquire high-resolution images.
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