An external-cavity laser module includes a package defining an enclosure, the package including a base having a surface internal to the enclosure, a thermoelectric cooler within the enclosure, the thermoelectric cooler including an upper carrier plate and a lower carrier plate, the lower carrier plate being placed on the internal surface of the base and the thermoelectric cooler (TEC) being configured to stabilize the temperature of the upper carrier plate at a substantially constant temperature. The laser module further includes a laser assembly housed within the enclosure, including a gain medium for emitting an optical beam into the external cavity and an end mirror. Variations of the environmental temperature with respect to the thermally stabilized temperature cause mechanical deformations of the TEC upper carrier plate that is in thermal coupling with the laser assembly. The mechanical deformations in turn induce variations in the optical path length of the laser cavity. Thermal bridge of the gain medium to the environmental temperature is achieved by the use of a thermal bridge element for conducting heat either from or to the gain medium.