Invention Grant
- Patent Title: Reducing acoustic coupling to microphone on printed circuit board
- Patent Title (中): 降低印刷电路板上与麦克风的声耦合
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Application No.: US11787657Application Date: 2007-04-17
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Publication No.: US08259982B2Publication Date: 2012-09-04
- Inventor: James Samuel Bowen
- Applicant: James Samuel Bowen
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H04R1/02
- IPC: H04R1/02
Abstract:
A mobile computing device comprises a printed circuit board, a processing circuit, a surface mount microphone, and a vibration attenuation portion. The processing circuit is disposed on a first portion of the printed circuit board. The surface mount microphone is disposed on a second portion of the printed circuit board. The vibration attenuation portion of the board is configured to attenuate vibrations from the first to the second portion of the printed circuit board.
Public/Granted literature
- US20080260181A1 Reducing acoustic coupling to microphone on printed circuit board Public/Granted day:2008-10-23
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