Invention Grant
- Patent Title: Pattern shape inspection method and apparatus thereof
- Patent Title (中): 图案形状检查方法及装置
-
Application No.: US12620713Application Date: 2009-11-18
-
Publication No.: US08260029B2Publication Date: 2012-09-04
- Inventor: Keiya Saito , Hideaki Sasazawa , Takenori Hirose
- Applicant: Keiya Saito , Hideaki Sasazawa , Takenori Hirose
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-295588 20081119
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
This invention relates to a pattern shape inspection method and an apparatus thereof for conducting a first step of irradiating wideband illuminating light which contains far ultraviolet light to a sample from a perpendicular direction, inspecting a shape of the pattern based on a spectral waveform of reflecting light detected from the sample, and detecting an edge roughness of the pattern based on the spectral waveform of the reflecting light detected from the sample, and a second step of irradiating a laser beam to the sample from an oblique direction, and detecting the edge roughness of the pattern based on scattered light detected from the sample.
Public/Granted literature
- US20100124370A1 PATTERN SHAPE INSPECTION METHOD AND APPARATUS THEREOF Public/Granted day:2010-05-20
Information query