Invention Grant
- Patent Title: Reconfigurable multi-processing coarse-grain array
- Patent Title (中): 可重构多处理粗粒阵列
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Application No.: US12209887Application Date: 2008-09-12
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Publication No.: US08261042B2Publication Date: 2012-09-04
- Inventor: Andreas Kanstein , Mladen Berekovic
- Applicant: Andreas Kanstein , Mladen Berekovic
- Applicant Address: BE Leuven US TX Austin
- Assignee: IMEC,Freescale Semiconductor, Inc.
- Current Assignee: IMEC,Freescale Semiconductor, Inc.
- Current Assignee Address: BE Leuven US TX Austin
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: GB0605349.0 20060317
- Main IPC: G06F15/76
- IPC: G06F15/76 ; G06F9/45

Abstract:
A signal processing device is adapted for simultaneous processing of at least two process threads in a multi-processing manner. The device comprises a plurality of functional units capable of executing word- or subword-level operations on data. The device further comprises means for interconnecting the plurality of functional units, the means for interconnecting supporting a plurality of dynamically switchable interconnect arrangements, and at least one of the interconnect arrangements interconnects the plurality of functional units into at least two non-overlapping processing units each with a pre-determined topology. The device further comprises at least two control modules each assigned to one of the processing units.
Public/Granted literature
- US20090070552A1 RECONFIGURABLE MULTI-PROCESSING COARSE-GRAIN ARRAY Public/Granted day:2009-03-12
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