Invention Grant
US08261044B2 Bus bandwidth sharing physically remote distributed processing functional nodes coupled to passive cooling interface assembly with minimal thermal path 有权
总线带宽共享物理上远程分布式处理功能节点耦合到具有最小热路径的被动冷却接口组件

  • Patent Title: Bus bandwidth sharing physically remote distributed processing functional nodes coupled to passive cooling interface assembly with minimal thermal path
  • Patent Title (中): 总线带宽共享物理上远程分布式处理功能节点耦合到具有最小热路径的被动冷却接口组件
  • Application No.: US11960465
    Application Date: 2007-12-19
  • Publication No.: US08261044B2
    Publication Date: 2012-09-04
  • Inventor: Gary A. Kinstler
  • Applicant: Gary A. Kinstler
  • Applicant Address: US IL Chicago
  • Assignee: The Boeing Company
  • Current Assignee: The Boeing Company
  • Current Assignee Address: US IL Chicago
  • Agency: Armstrong Teasdale, LLP
  • Main IPC: G06F15/16
  • IPC: G06F15/16
Bus bandwidth sharing physically remote distributed processing functional nodes coupled to passive cooling interface assembly with minimal thermal path
Abstract:
The distributed data handling and processing resources system of the present invention includes a) a number of data handling and processing resource nodes that collectively perform a desired data handling and processing function, each data handling and processing resource node for providing a data handling/processing subfunction; and, b) a low latency, shared bandwidth databus for interconnecting the data handling and processing resource nodes. In the least, among the data handling and processing resource nodes, is a processing unit (PU) node for providing a control and data handling/processing subfunction; and, an input/output (I/O) node for providing a data handling/processing subfunction for data collection/distribution to an external environment. The present invention preferably uses the IEEE-1394b databus due to its unique and specialized low latency, shared bandwidth characteristics.
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