Invention Grant
US08261222B2 Methods for analyzing and adjusting semiconductor device, and semiconductor system 有权
分析和调整半导体器件和半导体系统的方法

  • Patent Title: Methods for analyzing and adjusting semiconductor device, and semiconductor system
  • Patent Title (中): 分析和调整半导体器件和半导体系统的方法
  • Application No.: US12744525
    Application Date: 2008-11-17
  • Publication No.: US08261222B2
    Publication Date: 2012-09-04
  • Inventor: Yuichi Nakamura
  • Applicant: Yuichi Nakamura
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Priority: JP2007-304900 20071126
  • International Application: PCT/JP2008/070885 WO 20081117
  • International Announcement: WO2009/069496 WO 20090604
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Methods for analyzing and adjusting semiconductor device, and semiconductor system
Abstract:
Using fabrication-time variation predicting means that predicts this fact, the variation is predicted beforehand at the design stage prior to fabrication and is stored in variation prediction storage means. Rather than measuring a delay, testing an operation is performed (by a pass/fail determination) by actual-speed logic operation testing means for checking, after fabrication, whether a flip-flop (FF) operates at a specified operation frequency. As a result, the variation is estimated using the non-operation flip-flop (FF) information and the predicted value of the variation from the fabrication-time variation predicting means, and a delay value which corrects for the variation is inserted into a fabricated semiconductor integrated circuit by post-fabrication delay insertion position/value determining means using the variation value that has been estimated.
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