Invention Grant
US08264849B2 Mold compounds in improved embedded-die coreless substrates, and processes of forming same
有权
改进的嵌入式模芯无芯衬底中的模具化合物，以及其形成方法
- Patent Title: Mold compounds in improved embedded-die coreless substrates, and processes of forming same
- Patent Title (中): 改进的嵌入式模芯无芯衬底中的模具化合物，以及其形成方法
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Application No.: US12821847Application Date: 2010-06-23
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Publication No.: US08264849B2Publication Date: 2012-09-11
- Inventor: John S. Guzek
- Applicant: John S. Guzek
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/02
Abstract:
An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one stiffener layer that is integral to the coreless substrate and the stiffener layer is made of overmold material, underfill material, or prepreg material.
Public/Granted literature
- US20110317383A1 MOLD COMPOUNDS IN IMPROVED EMBEDDED-DIE CORELESS SUBSTRATES, AND PROCESSES OF FORMING SAME Public/Granted day:2011-12-29
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