Invention Grant
US08266793B2 Module having a stacked magnetic device and semiconductor device and method of forming the same
有权
具有堆叠磁性器件和半导体器件的模块及其形成方法
- Patent Title: Module having a stacked magnetic device and semiconductor device and method of forming the same
- Patent Title (中): 具有堆叠磁性器件和半导体器件的模块及其形成方法
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Application No.: US12393835Application Date: 2009-02-26
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Publication No.: US08266793B2Publication Date: 2012-09-18
- Inventor: Ashraf W. Lotfi , Douglas Dean Lopata , John David Weld , Mathew A. Wilkowski
- Applicant: Ashraf W. Lotfi , Douglas Dean Lopata , John David Weld , Mathew A. Wilkowski
- Applicant Address: US NJ Hampton
- Assignee: Enpirion, Inc.
- Current Assignee: Enpirion, Inc.
- Current Assignee Address: US NJ Hampton
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/20 ; H05K3/02 ; H05K3/10
Abstract:
A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.
Public/Granted literature
- US20100212150A1 Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same Public/Granted day:2010-08-26
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