Invention Grant
- Patent Title: Method of producing a wired circuit board
- Patent Title (中): 生产有线电路板的方法
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Application No.: US12662108Application Date: 2010-03-31
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Publication No.: US08266794B2Publication Date: 2012-09-18
- Inventor: Jun Ishii , Yasunari Ooyabu
- Applicant: Jun Ishii , Yasunari Ooyabu
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards
- Priority: JP2006-234115 20060830
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10
Abstract:
A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.
Public/Granted literature
- US20100186227A1 Wired circuit board and production method thereof Public/Granted day:2010-07-29
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