Invention Grant
US08267255B2 Sieve, sifting device, solder balls, and method of sifting spherical particles
有权
筛，筛选装置，焊球和筛选球形颗粒的方法
- Patent Title: Sieve, sifting device, solder balls, and method of sifting spherical particles
- Patent Title (中): 筛，筛选装置，焊球和筛选球形颗粒的方法
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Application No.: US12754665Application Date: 2010-04-06
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Publication No.: US08267255B2Publication Date: 2012-09-18
- Inventor: Seichin Kinuta
- Applicant: Seichin Kinuta
- Applicant Address: JP Tochigi
- Assignee: Optnics Precision Co., Ltd.
- Current Assignee: Optnics Precision Co., Ltd.
- Current Assignee Address: JP Tochigi
- Agency: SOLARIS Intellectual Property Group, PLLC
- Priority: JP2009-206057 20090907; JP2009-217027 20090918
- Main IPC: B07B1/46
- IPC: B07B1/46
Abstract:
This invention aims to enhance efficiency of a sieve and to greatly improve productivity of a sifting operation. There is provided a sieve comprising a metal plate including long holes, wherein the long holes are plurally provided such that lines extending in length directions thereof cross one another.
Public/Granted literature
- US20110056873A1 SIEVE, SIFTING DEVICE, SOLDER BALLS, AND METHOD OF SIFTING SPHERICAL PARTICLES Public/Granted day:2011-03-10
Information query
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