Invention Grant
US08267597B2 Mounting of optical device on mounting board to at least provide heat radiation 有权
将光学装置安装在安装板上至少提供热辐射

  • Patent Title: Mounting of optical device on mounting board to at least provide heat radiation
  • Patent Title (中): 将光学装置安装在安装板上至少提供热辐射
  • Application No.: US12545204
    Application Date: 2009-08-21
  • Publication No.: US08267597B2
    Publication Date: 2012-09-18
  • Inventor: Junichi Sasaki
  • Applicant: Junichi Sasaki
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Priority: JP2008-231693 20080910
  • Main IPC: G02B6/00
  • IPC: G02B6/00 G02B6/36
Mounting of optical device on mounting board to at least provide heat radiation
Abstract:
An optical module includes: an optical device mounting board including a first surface, a second surface on the reverse side, and a light transparent part allowing an emitted light traveling from the first surface to the second surface and a received light traveling in the opposite direction to pass through the transparent part; an optical device mounted on the first surface, which is a light emitting device or a light receiving device; a first terminal mounted on a surface except the first surface of the optical device mounting board; a wiring connecting a second terminal of a component mounted on the first surface including the optical device with the first terminal; and a transmission medium connector connecting a light transmission medium transmitting the emitted light traveling from the second surface to an outside of the optical module or the received light traveling in the opposite direction.
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