Invention Grant
- Patent Title: Fan module for dissipating heat
- Patent Title (中): 用于散热的风扇模块
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Application No.: US12644004Application Date: 2009-12-21
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Publication No.: US08267660B2Publication Date: 2012-09-18
- Inventor: Chao-Jui Huang
- Applicant: Chao-Jui Huang
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: F01D1/24
- IPC: F01D1/24 ; H05K7/20
Abstract:
A fan module includes a framework and at least two blade assemblies arranged inside the framework. Each blade assembly includes at least two blade units arranged in line. The rotating direction of each blade assembly is opposite to that of adjacent blade assembly.
Public/Granted literature
- US20110064561A1 FAN MODULE FOR DISSIPATING HEAT Public/Granted day:2011-03-17
Information query
