Invention Grant
- Patent Title: Socket contact
- Patent Title (中): 套接触
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Application No.: US12589452Application Date: 2009-10-23
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Publication No.: US08267729B2Publication Date: 2012-09-18
- Inventor: Masaki Yamashita , Kazuhito Hisamatsu , Yosuke Honda
- Applicant: Masaki Yamashita , Kazuhito Hisamatsu , Yosuke Honda
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee Address: JP Tokyo
- Agency: Collard & Roe, P.C.
- Priority: JP2008-332901 20081226
- Main IPC: H01R13/42
- IPC: H01R13/42
Abstract:
A socket contact is configured to receive a part of a mating contact. The socket contact comprises a spring portion, a spring support portion and a lance. The spring portion is brought into contact with the mating contact when the socket contact receives the part of the mating contact. The spring support portion supports the spring portion. The lance is provided on the spring support portion.
Public/Granted literature
- US20100167598A1 Socket contact Public/Granted day:2010-07-01
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