Invention Grant
- Patent Title: Method and apparatus for floor planks
- Patent Title (中): 地板的方法和装置
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Application No.: US12769736Application Date: 2010-04-29
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Publication No.: US08268110B2Publication Date: 2012-09-18
- Inventor: Chao Kang Pien
- Applicant: Chao Kang Pien
- Applicant Address: US NJ Edison
- Assignee: Advance Vinyl Floor Manufacturing Corp.
- Current Assignee: Advance Vinyl Floor Manufacturing Corp.
- Current Assignee Address: US NJ Edison
- Agent Walter J. Tencza, Jr.
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00 ; B32B38/04

Abstract:
A method comprising the steps of putting together a first piece including a wear layer, a pattern layer, and a base layer, arranged in a sandwich manner, such that the wear layer is on top of the pattern layer, the pattern layer is on top of the base layer, and the pattern layer is in between the wear layer and the base layer. The method may also include removing portions of the first piece to form a first floor plank, such as by removing a first substantially L-shaped portion of the wear layer, removing a second substantially L-shaped portion of the pattern layer, and removing a third substantially L-shaped portion of the base layer. Adhesive may be applied to locations on the first floor plank where substantially L-shaped portions have been removed to adhere the first floor plank to one or more substantially identical floor planks.
Public/Granted literature
- US20110265946A1 METHOD AND APPARATUS FOR FLOOR PLANKS Public/Granted day:2011-11-03
Information query