Invention Grant
- Patent Title: Method and device for encapsulating electronic components with a conditioning gas
- Patent Title (中): 用于用调节气体封装电子部件的方法和装置
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Application No.: US11632621Application Date: 2005-07-14
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Publication No.: US08268217B2Publication Date: 2012-09-18
- Inventor: Hendrikus Johannes Bernardus Peters , Arthur Theodorus Johannes Reijmer , Franciscus Bernardus Antonius De Vries , Johannes Lambertus Gerardus Marla Venrooij
- Applicant: Hendrikus Johannes Bernardus Peters , Arthur Theodorus Johannes Reijmer , Franciscus Bernardus Antonius De Vries , Johannes Lambertus Gerardus Marla Venrooij
- Applicant Address: NL RW Duiven
- Assignee: Fico B.V.
- Current Assignee: Fico B.V.
- Current Assignee Address: NL RW Duiven
- Agency: The Webb Law Firm, PC
- Priority: NL1026670 20040716; NL1028905 20050429
- International Application: PCT/NL2005/000509 WO 20050714
- International Announcement: WO2006/009429 WO 20060126
- Main IPC: B29C45/14
- IPC: B29C45/14
Abstract:
The invention relates to a method for encapsulating electronic components in a mold by the processing steps of: A) placing the electronic component for encapsulating in a mold cavity, and B) feeding an encapsulating material to the mold cavity, wherein at least a part of the mold surface defining the mold cavity is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. The invention also relates to a device for encapsulating an electronic component, in particular a semiconductor, with encapsulating material.
Public/Granted literature
- US20090026649A1 Method and Device for Encapsulating Electronic Components With a Conditioning Gas Public/Granted day:2009-01-29
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