Invention Grant
- Patent Title: Thermomechanical sealing of interconnect manifolds in fuel cell stacks
- Patent Title (中): 燃料电池堆中互连歧管的热机械密封
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Application No.: US12340918Application Date: 2008-12-22
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Publication No.: US08268504B2Publication Date: 2012-09-18
- Inventor: Shu Ching Quek , Andrew Philip Shapiro , Chandra Sekher Yerramalli , Michael Cheadle
- Applicant: Shu Ching Quek , Andrew Philip Shapiro , Chandra Sekher Yerramalli , Michael Cheadle
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Francis T. Coppa
- Main IPC: H01M8/02
- IPC: H01M8/02 ; H01M2/18

Abstract:
A planar fuel cell stack is provided. The planar fuel cell stack comprises an anode interconnect structure comprising a corrugated first internal manifold connected to a first anode flowfield; a cathode interconnect structure comprising a corrugated second internal manifold connected to a first cathode flowfield; and a thermally active, surface insulated metallic seal disposed between the corrugated parts of the anode and cathode interconnects, such that the thermally active metallic seal responds upon the application of heat to provide sealing between the anode interconnect structure and the cathode interconnect structure.
Public/Granted literature
- US20100159304A1 THERMOMECHANICAL SEALING OF INTERCONNECT MANIFOLDS IN FUEL CELL STACKS Public/Granted day:2010-06-24
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