Invention Grant
US08268530B2 Positive resist composition, method of forming resist pattern, polymeric compound, and compound
有权
正型抗蚀剂组合物，形成抗蚀剂图案的方法，聚合物和化合物
- Patent Title: Positive resist composition, method of forming resist pattern, polymeric compound, and compound
- Patent Title (中): 正型抗蚀剂组合物，形成抗蚀剂图案的方法，聚合物和化合物
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Application No.: US12762715Application Date: 2010-04-19
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Publication No.: US08268530B2Publication Date: 2012-09-18
- Inventor: Yoshiyuki Utsumi , Jun Iwashita
- Applicant: Yoshiyuki Utsumi , Jun Iwashita
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: C08F24/00
- IPC: C08F24/00 ; C08F34/02 ; G03C1/00 ; G03F7/00 ; G03F1/00
Abstract:
A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid and an acid generator component (B) which generates acid upon exposure, wherein the base component (A) includes a polymeric compound (A1) having a structural unit (a0) containing an acid-dissociable, dissolution-inhibiting group, and the acid-dissociable, dissolution-inhibiting group has a 1,3-dioxole skeleton.
Public/Granted literature
- US20100273106A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND Public/Granted day:2010-10-28
Information query
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