Invention Grant
US08268643B2 Substrate, epitaxial layer provided substrate, method for producing substrate, and method for producing epitaxial layer provided substrate
有权
基板,外延层提供的基板,制造基板的方法以及用于制造外延层的基板的方法
- Patent Title: Substrate, epitaxial layer provided substrate, method for producing substrate, and method for producing epitaxial layer provided substrate
- Patent Title (中): 基板,外延层提供的基板,制造基板的方法以及用于制造外延层的基板的方法
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Application No.: US13062590Application Date: 2009-09-04
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Publication No.: US08268643B2Publication Date: 2012-09-18
- Inventor: Naoki Matsumoto
- Applicant: Naoki Matsumoto
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2008-229445 20080908
- International Application: PCT/JP2009/065472 WO 20090904
- International Announcement: WO2010/027044 WO 20100311
- Main IPC: H01L21/66
- IPC: H01L21/66

Abstract:
The present invention provides a substrate formed at a low cost and having a controlled plate shape, an epitaxial layer provided substrate obtained by forming an epitaxial layer on the substrate, and methods for producing them. The method for producing the substrate according to the present invention includes an ingot growing step serving as a step of preparing an ingot formed of gallium nitride (GaN); and a slicing step serving as a step of obtaining a substrate formed of gallium nitride, by slicing the ingot. In the slicing step, the substrate thus obtained by the slicing has a main surface with an arithmetic mean roughness Ra of not less than 0.05 μm and not more than 1 μm on a line of 10 mm.
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