A process for manufacturing sealed organic EL devices includes a step of forming an organic EL layer on a region of an anode-mounted substrate having a substrate and an anode, the region including at least a bonding region in which a sealing member will be bonded and a region which is found inward the bonding region; a step of removing a portion of the organic EL layer which is found at least on the bonding region by applying plasma by a remote plasma method to expose the bonding region; a step of forming a cathode on the organic EL layer to complete an organic EL device; and a step of bonding a sealing member to the exposed bonding region.