Invention Grant
- Patent Title: Method for distributing fluorescence onto LED chip
- Patent Title (中): 在LED芯片上分配荧光的方法
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Application No.: US13149781Application Date: 2011-05-31
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Publication No.: US08268652B2Publication Date: 2012-09-18
- Inventor: Shiun-Wei Chan , Chih-Hsun Ke
- Applicant: Shiun-Wei Chan , Chih-Hsun Ke
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Altis Law Group, Inc.
- Priority: CN201010510416 20101018
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/00
Abstract:
A method for distributing fluorescence onto a light emitting diode chip includes steps: providing a base; mounting the LED chip having a light-emergent face on the base; disposing a baffle sleeve on the base whereby the baffle sleeve surrounds the LED chip; disposing a solid fusible block with the fluorescence mixed therein on the LED chip; heating the solid fusible block to be in a liquid state, and the fusible block flowing over the light-emergent face of the LED chip; and cooling the fusible block to be in a solid state again.
Public/Granted literature
- US20120094404A1 METHOD FOR DISTRIBUTING FLUORESCENCE ONTO LED CHIP Public/Granted day:2012-04-19
Information query
IPC分类:
