Invention Grant
- Patent Title: Alternative to desmear for build-up roughening and copper adhesion promotion
- Patent Title (中): 替代沉淀粗糙和铜附着力促进
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Application No.: US12619369Application Date: 2009-11-16
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Publication No.: US08268724B2Publication Date: 2012-09-18
- Inventor: Houssam Jomaa , Christine Tsau
- Applicant: Houssam Jomaa , Christine Tsau
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent David L. Guglielmi
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
In some embodiments, an alternative to desmear for build-up roughening and copper adhesion promotion is presented. In this regard, a substrate in introduced having a dielectric layer, a plurality of polyelectrolyte multilayers on the dielectric layer, and a copper plating layer on the polyelectrolyte multilayers. Other embodiments are also disclosed and claimed.
Public/Granted literature
- US20100059891A1 ALTERNATIVE TO DESMEAR FOR BUILD-UP ROUGHENING AND COPPER ADHESION PROMOTION Public/Granted day:2010-03-11
Information query
IPC分类:
