Invention Grant
- Patent Title: Methods and systems of transferring, docking and processing substrates
- Patent Title (中): 转移，对接和处理基材的方法和系统
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Application No.: US13038309Application Date: 2011-03-01
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Publication No.: US08268734B2Publication Date: 2012-09-18
- Inventor: Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
- Applicant: Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
- Applicant Address: KY Georgetown
- Assignee: Archers Inc.
- Current Assignee: Archers Inc.
- Current Assignee Address: KY Georgetown
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
In accordance with some embodiments described herein, a method for transferring a substrate to two or more process modules is provided, comprising loading at least one substrate into one or more mobile transverse chambers, the mobile transverse chambers being carried on a rail positioned adjacent to the two or more process modules, and wherein each mobile transverse chamber is configured to maintain a specified gas condition during conveyance of the substrate. One or more drive systems are actuated to propel at least one of the one or more mobile transverse chambers along the rail. The at least one mobile transfer chamber docks to at least one of the process modules, and the substrate is conveyed from the mobile transverse chamber to the at least one process modules.
Public/Granted literature
- US20110151119A1 Methods and Systems of Transferring, Docking and Processing Substrates Public/Granted day:2011-06-23
Information query
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