Invention Grant
- Patent Title: Heat aging resistant polyamides
- Patent Title (中): 耐热老化聚酰胺
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Application No.: US13139768Application Date: 2009-12-10
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Publication No.: US08268920B2Publication Date: 2012-09-18
- Inventor: Manoranjan Prusty , Philippe Desbois , Matthias Scheibitz , Martin Baumert
- Applicant: Manoranjan Prusty , Philippe Desbois , Matthias Scheibitz , Martin Baumert
- Applicant Address: DE
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE
- Agency: Connolly Bove Lodge & Hutz LLP
- Priority: EP08171803 20081216
- International Application: PCT/EP2009/066807 WO 20091210
- International Announcement: WO2010/076145 WO 20100708
- Main IPC: C08K3/08
- IPC: C08K3/08
Abstract:
Thermoplastic molding compositions comprising A) from 10 to 99.94% by weight of a polyamide, B) from 0.05 to 5% by weight of a polyethyleneimine homo- or copolymer, C) from 0.01 to 20% by weight of iron powder, and D) from 0 to 70% by weight of further additives, where the total of the percentages by weight of A) to D) is 100%.
Public/Granted literature
- US20120004353A1 HEAT AGING RESISTANT POLYAMIDES Public/Granted day:2012-01-05
Information query
