A thermoelectric module device with thin film elements is disclosed. A pillar structure with a hollow region is formed by stacking a plurality of thin-film type thermoelectric module elements, each including a plurality thin-film thermoelectric pairs arranged in a ring. An insulating and thermal conducting layer covers the inner sidewalls of the hollow region of the pillar structure and the outer sidewalls of the pillar structure. A cool source and a heat source are disposed in the hollow region or outer side of the pillar structure, respectively.