Invention Grant
- Patent Title: Transparent conductive film and conductive substrate using the same
- Patent Title (中): 透明导电膜和使用其的导电基板
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Application No.: US13076575Application Date: 2011-03-31
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Publication No.: US08269108B2Publication Date: 2012-09-18
- Inventor: Yousuke Kunishi , Hideki Suzuki , Hiroto Komatsu , Junichi Ikeno
- Applicant: Yousuke Kunishi , Hideki Suzuki , Hiroto Komatsu , Junichi Ikeno
- Applicant Address: JP JP
- Assignee: Shin Etsu Polymer Co., Ltd.,National University Corporation Saitama University
- Current Assignee: Shin Etsu Polymer Co., Ltd.,National University Corporation Saitama University
- Current Assignee Address: JP JP
- Agency: Ostrolenk Faber LLP
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H05K1/09
Abstract:
A transparent conductive film (12, 22) including a transparent base material (2) having insulation properties; and a mesh member made of a conductive metal and provided in the transparent base material (2), wherein the transparent base material (2) is provided with a conductive portion in which the mesh member is arranged, and an insulating portion (I) in which a gap (5) formed by removing the mesh member is arranged.
Public/Granted literature
- US20110291058A1 TRANSPARENT CONDUCTIVE FILM AND CONDUCTIVE SUBSTRATE USING THE SAME Public/Granted day:2011-12-01
Information query
