Invention Grant
- Patent Title: Fiber cutting mechanism and laser light source application apparatus comprising the mechanism
- Patent Title (中): 纤维切割机构和包括该机构的激光源应用装置
-
Application No.: US12376653Application Date: 2008-03-06
-
Publication No.: US08269139B2Publication Date: 2012-09-18
- Inventor: Hiroyuki Furuya , Kazuhisa Yamamoto , Shinichi Kadowaki
- Applicant: Hiroyuki Furuya , Kazuhisa Yamamoto , Shinichi Kadowaki
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-061475 20070312
- International Application: PCT/JP2008/000459 WO 20080306
- International Announcement: WO2008/111292 WO 20080918
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A fiber cutting mechanism prevents secondary utilization of a fiber laser light source that is incorporated in a device that uses a laser light. With a characteristic fiber cutting mechanism, when a laser device is separated from a laser light source application apparatus, at least a fiber is cut in an specific area from a point within a fiber grating to a connection point between the fiber grating and the fiber containing a laser activating substance.
Public/Granted literature
- US20100183037A1 FIBER CUTTING MECHANISM AND LASER LIGHT SOURCE APPLICATION APPARATUS COMPRISING THE MECHANISM Public/Granted day:2010-07-22
Information query