Invention Grant
- Patent Title: High strength stick electrode
- Patent Title (中): 高强度棒电极
-
Application No.: US11466917Application Date: 2006-08-24
-
Publication No.: US08269144B2Publication Date: 2012-09-18
- Inventor: Ashish Kapoor , Craig Dallam , Michael J. Morlock
- Applicant: Ashish Kapoor , Craig Dallam , Michael J. Morlock
- Applicant Address: US CA City of Industry
- Assignee: Lincoln Global, Inc.
- Current Assignee: Lincoln Global, Inc.
- Current Assignee Address: US CA City of Industry
- Agency: Perkins Coie LLP
- Main IPC: B23K35/22
- IPC: B23K35/22
Abstract:
A shielded metal arc welding electrode for depositing a high strength weld metal bead on a workpiece which satisfies the strength requirements under America Welding Society A5.5 standard's E11018M classification with no chromium added to the composition of the electrode.
Public/Granted literature
- US20070193995A1 HIGH STRENGTH STICK ELECTRODE Public/Granted day:2007-08-23
Information query
