Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
-
Application No.: US13113327Application Date: 2011-05-23
-
Publication No.: US08269246B2Publication Date: 2012-09-18
- Inventor: Bong Kul Min
- Applicant: Bong Kul Min
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2010-0051840 20100601
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.
Public/Granted literature
- US20110220927A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2011-09-15
Information query
IPC分类:
