Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
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Application No.: US12636534Application Date: 2009-12-11
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Publication No.: US08269249B2Publication Date: 2012-09-18
- Inventor: Yong Seon Song
- Applicant: Yong Seon Song
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2009-0013576 20090218
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L29/227 ; H01L33/00
Abstract:
A light emitting device package including a package body including a plurality of discrete and separated three-dimensional-shaped indentations formed in an undersurface of the package body and configured to dissipate heat generated in the package body, a cavity in the package body, and a light emitting device including at least one emitting diode in the cavity of the package body and configured to emit light.
Public/Granted literature
- US20100207144A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2010-08-19
Information query
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