Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12253563Application Date: 2008-10-17
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Publication No.: US08269288B2Publication Date: 2012-09-18
- Inventor: Toshiaki Iwamatsu , Takashi Terada , Hirofumi Shinohara , Kozo Ishikawa , Ryuta Tsuchiya , Kiyoshi Hayashi
- Applicant: Toshiaki Iwamatsu , Takashi Terada , Hirofumi Shinohara , Kozo Ishikawa , Ryuta Tsuchiya , Kiyoshi Hayashi
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-273679 20071022
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
An object of the present invention is to provide a semiconductor device having a fin-type transistor that is excellent in characteristics by forming a fin-shaped semiconductor portion and a gate electrode with high precision or by making improvement regarding variations in characteristics among elements. The present invention is a semiconductor device including a fin-shaped semiconductor portion having a source region formed on one side thereof and a drain region formed on the other side thereof, and a gate electrode formed between the source region and the drain region to surround the fin-shaped semiconductor portion with a gate insulating film interposed therebetween. One solution for solving the problem according to the invention is that the gate electrode uses a metal material or a silicide material that is wet etchable.
Public/Granted literature
- US20090101977A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-04-23
Information query
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