A camera module includes a sensor chip having a backside surface and a main surface including a sensor forming region and a sensor peripheral region surrounding the sensor forming region, in which a light receiving portion is disposed in the sensor forming region; a lens chip having a non-lens forming surface and a lens forming surface including a lens forming region and a lens peripheral region surrounding the lens forming region, in which a lens portion disposed in the lens forming region; a spacer portion for bonding the sensor peripheral region to the lens peripheral region with a specific space in between so that the light receiving portion faces the lens portion; and a cover including an opening portion for passing light from outside toward the lens portion and the light receiving portion.