Invention Grant
US08269298B2 Semiconductor module and camera module mounting said semiconductor module
失效
半导体模块和相机模块安装所述半导体模块
- Patent Title: Semiconductor module and camera module mounting said semiconductor module
- Patent Title (中): 半导体模块和相机模块安装所述半导体模块
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Application No.: US12727913Application Date: 2010-03-19
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Publication No.: US08269298B2Publication Date: 2012-09-18
- Inventor: Masayuki Nagamatsu , Ryosuke Usui , Yasunori Inoue
- Applicant: Masayuki Nagamatsu , Ryosuke Usui , Yasunori Inoue
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2009-086620 20090331
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills.
Public/Granted literature
- US20100244171A1 SEMICONDUCTOR MODULE AND CAMERA MODULE MOUNTING SAID SEMICONDUCTOR MODULE Public/Granted day:2010-09-30
Information query
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