Invention Grant
- Patent Title: Semiconductor device with resistive element
- Patent Title (中): 具有电阻元件的半导体器件
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Application No.: US12457172Application Date: 2009-06-03
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Publication No.: US08269312B2Publication Date: 2012-09-18
- Inventor: Naoki Izumi
- Applicant: Naoki Izumi
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2008-147872 20080605; JP2008-149440 20080606
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A semiconductor device according to an aspect of the present invention includes a semiconductor layer, an insulating film formed on the surface of the semiconductor layer, a first insulator embedded in the semiconductor layer with a thickness larger than the thickness of the insulating film, and a resistive element formed on the first insulator. A semiconductor device according to another aspect of the present invention includes a semiconductor layer, an insulating film formed on the surface of the semiconductor layer, a resistive element formed on the insulating film, and a floating region formed on a portion of the semiconductor layer opposed to the resistive element through the insulating film and electrically floating from a periphery thereof.
Public/Granted literature
- US20090302384A1 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE Public/Granted day:2009-12-10
Information query
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