Invention Grant
US08269312B2 Semiconductor device with resistive element 有权
具有电阻元件的半导体器件

  • Patent Title: Semiconductor device with resistive element
  • Patent Title (中): 具有电阻元件的半导体器件
  • Application No.: US12457172
    Application Date: 2009-06-03
  • Publication No.: US08269312B2
    Publication Date: 2012-09-18
  • Inventor: Naoki Izumi
  • Applicant: Naoki Izumi
  • Applicant Address: JP Kyoto
  • Assignee: Rohm Co., Ltd.
  • Current Assignee: Rohm Co., Ltd.
  • Current Assignee Address: JP Kyoto
  • Agency: Rabin & Berdo, P.C.
  • Priority: JP2008-147872 20080605; JP2008-149440 20080606
  • Main IPC: H01L29/00
  • IPC: H01L29/00
Semiconductor device with resistive element
Abstract:
A semiconductor device according to an aspect of the present invention includes a semiconductor layer, an insulating film formed on the surface of the semiconductor layer, a first insulator embedded in the semiconductor layer with a thickness larger than the thickness of the insulating film, and a resistive element formed on the first insulator. A semiconductor device according to another aspect of the present invention includes a semiconductor layer, an insulating film formed on the surface of the semiconductor layer, a resistive element formed on the insulating film, and a floating region formed on a portion of the semiconductor layer opposed to the resistive element through the insulating film and electrically floating from a periphery thereof.
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