Invention Grant
- Patent Title: Tape wiring substrate and tape package using the same
- Patent Title (中): 胶带布线基板和胶带包装使用相同
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Application No.: US13069520Application Date: 2011-03-23
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Publication No.: US08269322B2Publication Date: 2012-09-18
- Inventor: Dong-Han Kim
- Applicant: Dong-Han Kim
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR2006-29662 20060331
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween. Connecting wiring patterns may be configured to connect the dispersion wiring patterns to a first end of the adjacent input/output wiring pattern.
Public/Granted literature
- US20110169148A1 TAPE WIRING SUBSTRATE AND TAPE PACKAGE USING THE SAME Public/Granted day:2011-07-14
Information query
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