Invention Grant
- Patent Title: Multichip package leadframe including electrical bussing
- Patent Title (中): 包括电气总线的多芯片封装引线框架
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Application No.: US13029574Application Date: 2011-02-17
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Publication No.: US08269334B1Publication Date: 2012-09-18
- Inventor: Michael D. Cusack
- Applicant: Michael D. Cusack
- Applicant Address: BM Hamilton
- Assignee: Marvell International Ltd.
- Current Assignee: Marvell International Ltd.
- Current Assignee Address: BM Hamilton
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
Embodiments of the present invention provide electrical bussing for multichip leadframes. In various embodiments, a leadframe may comprise a first die paddle for receiving a first microelectronic device, a second die paddle for receiving a second microelectronic device, and at least one electrical bus disposed between the first die paddle and the second die paddle.
Information query
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