Invention Grant
- Patent Title: Semiconductor packages including heat slugs
- Patent Title (中): 半导体封装包括散热片
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Application No.: US12801274Application Date: 2010-06-01
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Publication No.: US08269342B2Publication Date: 2012-09-18
- Inventor: Yonghoon Kim , Heeseok Lee , Eunseok Cho , Hyuna Kim , Soyoung Lim , PaLan Lee
- Applicant: Yonghoon Kim , Heeseok Lee , Eunseok Cho , Hyuna Kim , Soyoung Lim , PaLan Lee
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0066357 20090721
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.
Public/Granted literature
- US20110018119A1 Semiconductor packages including heat slugs Public/Granted day:2011-01-27
Information query
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